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Items where Person is "Dulondel, Frédéric"

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Number of items: 5.

Article

Libot, Jean-Baptiste and Alexis, Joël and Dalverny, Olivier and Arnaud, Lionel and Milesi, Philippe and Dulondel, Frédéric. Experimental SAC305 shear stress-strain hysteresis loop construction using Hall's one-dimensional model based on strain gages measurements. (2019) Journal of Electronic Packaging, 141 (2). 021002-1-021002-15. ISSN 1043-7398

Libot, Jean-Baptiste and Alexis, Joël and Dalverny, Olivier and Arnaud, Lionel and Milesi, Philippe and Dulondel, Frédéric. Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling. (2018) Microelectronics Reliability, 83. 64-76. ISSN 0026-2714

Conference or Workshop Item

Libot, Jean-Baptiste and Dulondel, Frédéric and Milesi, Philippe and Alexis, Joël and Arnaud, Lionel and Dalverny, Olivier. Experimental strain energy density dissipated in SAC305 solder joints during different thermal cycling conditions using strain gages measurements. (2018) In: IEEE 68th Electronic Components and Technology Conference, 29 May 2018 - 1 June 2018 (San Diego, United States).

Libot, Jean-Baptiste and Arnaud, Lionel and Dalverny, Olivier and Alexis, Joël and Milesi, Philippe and Dulondel, Frédéric. Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations. (2016) In: 2016 International Conference on Electronics Packaging (ICEP 2016), 20 April 2016 - 22 April 2016 (Sapporo, Japan).

Libot, Jean-Baptiste and Arnaud, Lionel and Dalverny, Olivier and Alexis, Joël and Milesi, Philippe and Dulondel, Frédéric. Mechanical fatigue assessment of SAC305 solder joints under harmonic and random vibrations. (2016) In: 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2016), 18 April 2016 - 20 April 2016 (Dresden, Germany).

This list was generated on Tue Jul 16 00:56:13 2019 CEST.