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Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes

Medjahed, Hassen and Vidal, Paul-Etienne and Nogarède, Bertrand Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes. (2012) Microelectronics Reliability, 52 (6). 1099-1104. ISSN 0026-2714

(Document in English)

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Official URL: http://dx.doi.org/10.1016/j.microrel.2012.01.013


Today, power electronic reliability is a main subject of interest for many companies and laboratories. The main process leading to the IGBT failure is the cycling thermal stress. Indeed the current flow induce local heating and then mechanical stress. This paper deals with electro thermal stress under steady and transient current states. The main objective is to test bonded wires with active current cycle. Consequently, the thermo mechanical stress is obtained. A numerical 3D finite element model is presented and some experimental results are given. Indeed an infrared system monitors the temperature dispatching from an experimental test bench under active current cycle. The overall study is a first step before a global simulation (electrical thermal-mechanical) in order to optimize some geometric parameters of the packaging.

Item Type:Article
Additional Information:Thanks to Elsevier editor. The definitive version is available at http://www.sciencedirect.com The original PDF of the article can be found at Microelectronics Reliability website : http://dx.doi.org/10.1016/j.microrel.2012.01.013
HAL Id:hal-00815975
Audience (journal):International peer-reviewed journal
Uncontrolled Keywords:
Institution:French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE)
Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
Université de Toulouse > Université Toulouse III - Paul Sabatier - UT3 (FRANCE)
Laboratory name:
Deposited On:19 Apr 2013 13:42

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