Kiryukhina, Kateryna and Le Trong, Hoa and Tailhades, Philippe and Lacaze, Jacques and Baco-Carles, Valérie and Gougeon, Michel and Courtade, Frédéric and Dareys, Sophie and Vendier, Olivier and Raynaud, Lidwine Silver oxalate-based solders: New materials for high thermal conductivity microjoining. (2013) Scripta Materialia, 68 (8). 623-626. ISSN 1359-6462
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(Document in English)
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Official URL: http://dx.doi.org/10.1016/j.scriptamat.2012.12.018
Abstract
Micrometric oxalate powders can be decomposed starting from temperatures as low as 90°C, leading to the formation of temporary nanometric grains of metallic silver with a high propensity for sintering. The decomposition being highly exothermic, this additional energy favours the sintering, i.e. the soldering, process. Solders processed at 300°C and very low pressure (<0.5 MPa) displayed a thermal conductivity close to 100 W m-1 K-1, making silver oxalate very promising for safe, moderate temperature and very low pressure bonding.
Item Type: | Article |
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Additional Information: | Thanks to Elsevier editor. The original publication is available at http://www.sciencedirect.com |
HAL Id: | hal-00832138 |
Audience (journal): | International peer-reviewed journal |
Uncontrolled Keywords: | |
Institution: | French research institutions > Centre National d'Études Spatiales - CNES (FRANCE) French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE) Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE) Other partners > Thales (FRANCE) Université de Toulouse > Université Toulouse III - Paul Sabatier - UT3 (FRANCE) Other partners > Vietnam National University - VNU (VIETNAM) |
Laboratory name: | |
Statistics: | download |
Deposited On: | 10 Jun 2013 09:22 |
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