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Silver oxalate-based solders: New materials for high thermal conductivity microjoining

Kiryukhina, Kateryna and Le Trong, Hoa and Tailhades, Philippe and Lacaze, Jacques and Baco-Carles, Valérie and Gougeon, Michel and Courtade, Frédéric and Dareys, Sophie and Vendier, Olivier and Raynaud, Lidwine Silver oxalate-based solders: New materials for high thermal conductivity microjoining. (2013) Scripta Materialia, 68 (8). 623-626. ISSN 1359-6462

(Document in English)

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Official URL: http://dx.doi.org/10.1016/j.scriptamat.2012.12.018


Micrometric oxalate powders can be decomposed starting from temperatures as low as 90°C, leading to the formation of temporary nanometric grains of metallic silver with a high propensity for sintering. The decomposition being highly exothermic, this additional energy favours the sintering, i.e. the soldering, process. Solders processed at 300°C and very low pressure (<0.5 MPa) displayed a thermal conductivity close to 100 W m-1 K-1, making silver oxalate very promising for safe, moderate temperature and very low pressure bonding.

Item Type:Article
Additional Information:Thanks to Elsevier editor. The original publication is available at http://www.sciencedirect.com
HAL Id:hal-00832138
Audience (journal):International peer-reviewed journal
Uncontrolled Keywords:
Institution:French research institutions > Centre National d'Études Spatiales - CNES (FRANCE)
French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE)
Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
Other partners > Thales (FRANCE)
Université de Toulouse > Université Toulouse III - Paul Sabatier - UT3 (FRANCE)
Other partners > Vietnam National University - VNU (VIETNAM)
Laboratory name:
Deposited On:10 Jun 2013 09:22

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