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Al–Cu intermetallic coatings processed by sequential metalorganic chemical vapour deposition and post-deposition annealing

Aloui, Lyacine and Duguet, Thomas and Haidara, Fanta and Record, Marie-Christine and Samélor, Diane and Senocq, François and Mangelinck, Dominique and Vahlas, Constantin Al–Cu intermetallic coatings processed by sequential metalorganic chemical vapour deposition and post-deposition annealing. (2012) Applied Surface Science, 258 (17). 6425-6430. ISSN 0169-4332

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Official URL: http://dx.doi.org/10.1016/j.apsusc.2012.03.053


Sequential processing of aluminum and copper followed by reactive diffusion annealing is used as a paradigm for the metalorganic chemical vapour deposition (MOCVD) of coatings containing intermetallic alloys. Dimethylethylamine alane and copper N,N'-di-isopropylacetamidinate are used as aluminum and copper precursors, respectively. Deposition is performed on steel and silica substrates at 1.33 kPa and 493–513 K. Different overall compositions in the entire range of the Al–Cu phase diagram are obtained by varying the relative thickness of the two elemental layers while maintaining the overall thickness of the coating close to 1 µm. As-deposited films present a rough morphology attributed to the difficulty of copper to nucleate on aluminum. Post-deposition annealing is monitored by in situ X-ray diffraction, and allows smoothening the microstructure and identifying conditions leading to several Al–Cu phases. Our results establish a proof of principle following which MOCVD of metallic alloys is feasible, and are expected to extend the materials pool for numerous applications, with innovative thin film processing on, and surface properties of complex in shape parts.

Item Type:Article
Additional Information:Thanks to Elsevier editor. The definitive version is available at http://www.sciencedirect.com/science/article/pii/S0169433212004795
HAL Id:hal-01756334
Audience (journal):International peer-reviewed journal
Uncontrolled Keywords:
Institution:Other partners > Aix-Marseille Université - AMU (FRANCE)
French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE)
Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
Université de Toulouse > Université Toulouse III - Paul Sabatier - UT3 (FRANCE)
Other partners > Université du Sud Toulon-Var - USTV (FRANCE)
Other partners > Ecole Centrale Marseille (FRANCE)
Other partners > Institut Supérieur d’Electronique et du Numérique - ISEN (FRANCE)
Laboratory name:
Deposited On:16 Jul 2013 09:00

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