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Coupled visco-mechanical and diffusion void growth modelling during composite curing

Ledru, Yohann and Bernhart, Gérard and Piquet, Robert and Schmidt, Fabrice and Michel, Laurent Coupled visco-mechanical and diffusion void growth modelling during composite curing. (2010) Composites Science and Technology, 70 (15). 2139-2145. ISSN 0266-3538

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Official URL: http://dx.doi.org/10.1016/j.compscitech.2010.08.013


Most critical processing step during long fiber reinforced epoxy matrix composite laminate manufacturing is the polymerization stage. If not optimized, it gives birth to defects in the bulk material, such as voids. These defects are considered as possible sources of damage in the composite parts. The aim of this work is to model the evolution of void growth in thermoset composite laminates after ply collation (autoclave processes) or resin impregnation (RTM, LCM process). A coupled mechanical and diffusion model is presented to better predict the final void size at the end of polymerization. Amongst the parameter investigated, onset of pressure application and diffusive species concentration where found to have a major effect on void size evolution during curing process.

Item Type:Article
HAL Id:hal-01852291
Audience (journal):International peer-reviewed journal
Uncontrolled Keywords:
Institution:Université de Toulouse > Ecole nationale supérieure des Mines d'Albi-Carmaux - IMT Mines Albi (FRANCE)
Université de Toulouse > Institut National des Sciences Appliquées de Toulouse - INSA (FRANCE)
Université de Toulouse > Institut Supérieur de l'Aéronautique et de l'Espace - ISAE-SUPAERO (FRANCE)
Université de Toulouse > Université Toulouse III - Paul Sabatier - UT3 (FRANCE)
Laboratory name:
Deposited On:14 Dec 2010 09:20

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