Chasserio, Nadège and Guillemet-Fritsch, Sophie and Lebey, Thierry and Dagdag, Sélim Ceramic Substrates for High-temperature Electronic Integration. (2009) Journal of Electronic Materials, 38 (1). 164-174. ISSN 0361-5235
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(Document in English)
PDF (Author's version) - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader 611kB |
Official URL: http://dx.doi.org/10.1007/s11664-008-0571-8
Abstract
One of the most attractive ways to increase power handling capacity in power modules is to increase the operating temperature using wide-band-gap semiconductors. Ceramics are ideal candidates for use as substrates in high-power high-temperature electronic devices. The present article aims to determine the most suitable ceramic material for this application.
| Item Type: | Article |
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| Additional Information: | Thanks to Springer Boston editor. The definitive version is available at http://www.springer.com/birkhauser?SGWID=0-40290-0-0-0 The original PDF of the article can be found at Journal of Electronic Materials website : http://www.springerlink.com/content/7807j52g68435t19/ |
| Audience (journal): | International peer-reviewed journal |
| Uncontrolled Keywords: | |
| Institution: | French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE) Université de Toulouse > Institut National Polytechnique de Toulouse - INPT (FRANCE) Université de Toulouse > Université Toulouse III - Paul Sabatier - UPS (FRANCE) Other partners > ALSTOM Transport (FRANCE) |
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| Statistics: | download |
| Deposited By: | Nihad Lahdifi |
| Deposited On: | 11 Jan 2011 12:41 |
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