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Ceramic Substrates for High-temperature Electronic Integration

Chasserio, Nadège and Guillemet-Fritsch, Sophie and Lebey, Thierry and Dagdag, Sélim Ceramic Substrates for High-temperature Electronic Integration. (2009) Journal of Electronic Materials, 38 (1). 164-174. ISSN 0361-5235

(Document in English)

PDF (Author's version) - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader

Official URL: http://dx.doi.org/10.1007/s11664-008-0571-8


One of the most attractive ways to increase power handling capacity in power modules is to increase the operating temperature using wide-band-gap semiconductors. Ceramics are ideal candidates for use as substrates in high-power high-temperature electronic devices. The present article aims to determine the most suitable ceramic material for this application.

Item Type:Article
Additional Information:Thanks to Springer Boston editor. The definitive version is available at http://www.springer.com/birkhauser?SGWID=0-40290-0-0-0 The original PDF of the article can be found at Journal of Electronic Materials website : http://www.springerlink.com/content/7807j52g68435t19/
Audience (journal):International peer-reviewed journal
Uncontrolled Keywords:
Institution:French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE)
Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
Université de Toulouse > Université Toulouse III - Paul Sabatier - UT3 (FRANCE)
Other partners > ALSTOM Transport (FRANCE)
Laboratory name:
Deposited On:11 Jan 2011 12:41

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