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Galvanic coupling between copper and aluminium in a thin-layer cell

Blanc, Christine and Pébère, Nadine and Tribollet, Bernard and Vivier, Vincent Galvanic coupling between copper and aluminium in a thin-layer cell. (2010) Corrosion Science, 52 (3). 991-995. ISSN 0010-938X

(Document in English)

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Official URL: http://dx.doi.org/10.1016/j.corsci.2009.11.023


The Al/Cu coupling was investigated in a thin-layer cell formed by a large Cu electrode and an Al microelectrode embedded in an insulator placed above the Cu electrode. By using a scanning electrochemical microscope (SECM) the thickness of the thin layer was perfectly controlledwith a precision in the micrometer range. A copper deposit on an electrochemical quartz crystal microbalance (EQCM) was also used as SECM substrate to quantify the copper dissolution rate. It was shown that such an experimental set-up allows to mimic the galvanic corrosion of intermetallic particles embedded in the aluminium matrix of the 2XXX series aluminium alloys. The combination of the SECM and the EQCM permitted the evaluation of the corrosion rate of copper at the corrosion potential of the 2024 Al alloy, whereas cyclic voltammetry performed on the SECM tip indicated the enrichment in Cu2+ ions in the thin electrolyte layer.

Item Type:Article
Additional Information:Thanks to Elsevier editor. The definitive version is available at http://www.sciencedirect.com The original PDF of the article can be found at Corrosion Science website : http://www.sciencedirect.com/science/journal/0010938X
HAL Id:hal-03557679
Audience (journal):International peer-reviewed journal
Uncontrolled Keywords:
Institution:Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
Other partners > Université Pierre et Marie Curie, Paris 6 - UPMC (FRANCE)
Université de Toulouse > Université Toulouse III - Paul Sabatier - UT3 (FRANCE)
French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE)
Laboratory name:
Deposited On:21 Jul 2010 13:13

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