OATAO - Open Archive Toulouse Archive Ouverte Open Access Week

Soft sensor design for estimation of thermal behavior of encapsulating materials in power electronic module

Trajin, Baptiste and Sakhraoui, Imane and Rotella, Frédéric Soft sensor design for estimation of thermal behavior of encapsulating materials in power electronic module. (2021) In: 32th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 4 October 2021 - 7 October 2021 (Bordeaux, France).

[img]
Preview
(Document in English)

PDF (Author's version) - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader
568kB

Official URL: https://doi.org/10.1016/j.microrel.2021.114254

Abstract

With the emergence of new semi-conductor technologies, an increasing number of high integrated power electronic modules are designed. The increase of reliability of power modules induces the precise knowledge of the local temperature, even if it cannot be measured at any location. In this paper, the design of a soft sensor, more precisely a linear functional observer, is proposed. It enables the estimation of the temperature at any location using measurements provided from thermal sensors located at a number of precise points. The aim is to design a reduced size observer that could be implemented on a real-time embedded target such as Digital Signal Processor. Consequently, it is necessary to obtain a minimal order observer to limit the computation complexity.

Item Type:Conference or Workshop Item (Poster)
Additional Information:Diffusion en l'absence de réponse au sujet de la politique éditoriale.
HAL Id:hal-03467815
Audience (conference):International conference proceedings
Uncontrolled Keywords:
Institution:Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
Laboratory name:
Funders:
ANR
Statistics:download
Deposited On:16 Nov 2021 09:51

Repository Staff Only: item control page