Tardieu, Simon and Mesguich, David and Lonjon, Antoine
and Lecouturier, Florence
and Ferreira, Nelson and Chevallier, Geoffroy
and Proietti, Arnaud
and Estournès, Claude
and Laurent, Christophe
High Strength-High Conductivity Silver Nanowire-Copper Composite Wires by Spark Plasma Sintering and Wire-Drawing for Non-Destructive Pulsed Fields.
(2020)
IEEE Transactions on Applied Superconductivity, 30 (4). 1-4. ISSN 1051-8223
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(Document in English)
PDF (Author's version) - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader 1MB |
Official URL: https://doi.org/10.1109/TASC.2020.2974420
Abstract
New Ag-Cu composite wires are developed for the winding of non-destructive pulsed magnets. Silver nanowires were mixed with a micrometric copper powder. Copper and 1, 5 and 10 vol. % silver-copper cylinders were prepared by spark plasma sintering. They served as starting materials for room temperature wire-drawing, enabling the preparation of conducting wires containing copper ultrafine elongated grains and silver nanowires located at the grain boundaries. The tensile strength at 293 K and 77 K for the composite wires is more than twice those for the corresponding pure copper wires. The electrical resistivity is however increased and we show that the composites containing only 1 vol. % silver offer the best compromise
Item Type: | Article |
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HAL Id: | hal-02864517 |
Audience (journal): | International peer-reviewed journal |
Uncontrolled Keywords: | |
Institution: | French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE) Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE) Université de Toulouse > Institut National des Sciences Appliquées de Toulouse - INSA (FRANCE) Université de Toulouse > Université Toulouse III - Paul Sabatier - UT3 (FRANCE) Other partners > Université de Grenoble (FRANCE) |
Laboratory name: | |
Statistics: | download |
Deposited On: | 11 Jun 2020 08:27 |
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