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Study of packaging reliability of two SiC Schottky diodes of power electronic

Parent, Guillaume and Huleux, Vincent and Massiot, Gregor and Vidal, Paul-Etienne and Rouet, Vincent and Munier, Catherine and Carrillo, Francisco Javier Study of packaging reliability of two SiC Schottky diodes of power electronic. (2015) In: From Nano to Macro Power Electronics and Packaging, 2015, Tours, 15 October 2015 (Tours, France).

(Document in English)

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This study deals with reliability methods developed for power electronic devices dedicated to the aerospace industry, because the reliability is a key issue for safe aerospace applications. Based on end-user requirements, eight different types of non-hermetic power electronic components in standard plastic package have been selected from the commercial marketplace, in particular Si and SiC power electronic devices. These devices are COTS (Component Off The Shelf). The main failure modes and mechanisms expected have been highlighted in specific environments in accordance with the literature. They will be presented in the final paper.

Item Type:Conference or Workshop Item (Other)
HAL Id:hal-03033243
Audience (journal):International peer-reviewed journal
Audience (conference):National conference proceedings
Uncontrolled Keywords:
Institution:Other partners > Airbus (FRANCE)
Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
Laboratory name:
Deposited On:20 Oct 2020 14:31

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