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Understanding mechanisms of adhesion of SiO2 thin films evaporated on a polymeric substrate

Ho, Caroline and Dehoux, Anita and Alexis, Joël and Lacroix, Loïc and Dalverny, Olivier and Châtel, Sébastien and Faure, Bruce Understanding mechanisms of adhesion of SiO2 thin films evaporated on a polymeric substrate. (2016) In: 43th International Conference on Metallurgical Coatings and Thin Films (ICMCTF), 25 April 2016 - 29 April 2016 (San Diego, United States). (Unpublished)

(Document in English)

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A better understanding of mechanisms of adhesion between a 200 nm thick silicon dioxide layer and a 4.5 µm thick polymeric hardcoat is indispensable for an efficient adhesion at the interface. To reach this purpose, focus is placed on two axes: finding an applicable and effective method to quantify adhesion and in parallel, characterizing mechanical properties of materials composing the system. The second axis is needed to obtain data to feed modeling codes, enabling a better analysis of the adhesion experiment. Modulus of modified Si02 was found to be roughly 20% higher than reference Si02, by nanoindentation. AFM experiments showed no difference between modified and reference Si02• Currently, an investigation to detect cracks at the interface of interest for micro-tensile test is ongoing. Adhesion tests, such as micro-compression will be performed as well.

Item Type:Conference or Workshop Item (Poster)
HAL Id:hal-02387348
Audience (conference):International conference proceedings
Uncontrolled Keywords:
Institution:Other partners > Essilor (FRANCE)
Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
Laboratory name:
Deposited On:08 Nov 2019 15:21

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