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Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes

Dalverny, Olivier and Alexis, Joël Thermo-mechanical behavior of power electronic packaging assemblies: From characterization to predictive simulation of lifetimes. (2018) In: 7th International Conference on Structural Analysis of Advanced Materials, ICSAAM 2017, 19 September 2017 - 22 September 2017 (Bucharest, Romania).

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Official URL: https://doi.org/10.1063/1.5024159

Abstract

This article deals with thermo-mechanical behavior of power electronic modules used in several transportation applications as railway, aeronautic or automotive systems. Due to a multi-layered structures, involving different materials with a large variation of coefficient of thermal expansion, temperature variations originated from active or passive cycling (respectively from die dissipation or environmental constraint) induces strain and stresses field variations, giving fatigue phenomenon of the system. The analysis of the behavior of these systems and their dimensioning require the implementation of complex modeling strategies by both the multi-physical and the multi-scale character of the power modules. In this paper we present some solutions for studying the thermomechanical behavior of brazed assemblies as well as taking into account the interfaces represented by the numerous metallizations involved in the process assembly.

Item Type:Conference or Workshop Item (Paper)
HAL Id:hal-02359830
Audience (conference):International conference proceedings
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Institution:Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
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Deposited On:05 Apr 2019 15:17

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