Modelling and simulation of brittle damage in ceramic assemblies

Abstract

The design and realization of optimized technological systems are increasing through development and integration of different functions and combining elements of varied nature. Not only in the field of space but also in power electronics, many ceramic parts are linked by various processes to metallic elements of different physical and mechanical properties. When these assemblies are subjected to high levels of thermomechanical loadings, their heterogeneities generate significant over-stresses that can lead to irreversible damage. A damage model for microcracking in brittle materials taking into account the opening or closing of microcracks (unilateral effect) has been developed by Welemane and Cormery under isothermal conditions. This article gives an overview of damage modelling and the progress made in accounting for temperature effects.