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Mechanical behavior and adhesion of the Ti/Cr/Au metallization scheme on diamond substrate

Msolli, Sabeur and Alexis, Joël and Kim, Heung Soo Mechanical behavior and adhesion of the Ti/Cr/Au metallization scheme on diamond substrate. (2017) Advanced Engineering Materials, 19 (8). ISSN 1438-1656

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Official URL: http://dx.doi.org/10.1002/adem.201700109

Abstract

The mechanical properties of a Ti/Cr/Au metallization system deposited on a heavily doped diamond substrate are valuated, first using nano-indentation tests. Various kinds of conditions are adopted, such as small and high force loadings. These tests are completed by in situ scanning electron microscopy observations of the surface. The adhesion of such multilayer on the diamond substrate is assessed using nano-scratching tests. The profiles of the obtained scratches are analyzed to detect any singularities or defects. Finally, a cross-section topography is performed, in order to obtain the cross profile of the scratch, and to determine the scratch hardness parameter of the metallization system. The Ti/Cr/Au metallization system is a potential candidate to play the role of ohmic contact on diamond. Therefore, its adhesion to diamond is important, since the whole power electronic assembly is mainly subjected to thermal cycling during service. The metallization system must adhere well to diamond, so as to resist temperature gradients and thermal strains that are widely observed in extreme thermal conditions. Otherwise, debonding phenomena may occur, and the whole electronic packaging fail.

Item Type:Article
Additional Information:12 months embargo since publication date. Thanks to Elsevier editor. The definitive version is available at : http://onlinelibrary.wiley.com/journal/10.1002/(ISSN)1527-2648
HAL Id:hal-01658017
Audience (journal):International peer-reviewed journal
Uncontrolled Keywords:
Institution:Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
Other partners > Dongguk University (REPUBLIC OF KOREA)
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Deposited On:09 Nov 2017 16:04

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