A double side cooled Electronic Power Module

Abstract

Double side cooling and wire-bondless interconnections are envisioned as ways to go for Electronic Power Modules. aPSI3D has developed an integrated approach for the design of such a power module. Prototypes have been manufactured and characterized in terms of electronics and thermo-fluidics. The parasitic self-inductance which involves the physical copper layers carrying the main current are significantly reduced, in agreement with previous simulations. An electro-thermal liquid cooled bench was fully developed by ICAM in order to extract the Power Module thermo-fluidic behavior. Thermal resistance are extracted and compared to simulations. During these characterizations, several material interfaces were identified as critical for the thermal behavior.