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M-STORM Reliability model applied to DSM Technologies

Bensoussan, Alain M-STORM Reliability model applied to DSM Technologies. (2016) In: NMDC 2016 (Nanotechnology Materials and Devices Conference), 9 October 2016 - 12 October 2016 (Toulouse, France).

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Official URL: http://dx.doi.org/10.1109/NMDC.2016.7777115


Failure mechanisms described in JEDEC publication JEP122G constitute commonly accepted models for silicon device physics of failure. Such models are generally described in term of stress parameters and/or specifically measured drift parameters; however, they consider only a single stress condition, single parameter signature and single failure mechanism at a time. When considering new disruptive technologies for deep submicron integrated circuits, the shrinkage of geometries (down and lower than the 20 nm range) induces shrinkage of electrical parameter limits and condition of use may produce multiple-stress in operation jointly producing multiple failure mechanisms concurrently. This paper is related to the generalized Reliability Model for semiconductor devices called M-STORM for Multi-phySics mulTi-stressOrs predictive Reliability Model.

Item Type:Conference or Workshop Item (Paper)
Additional Information:Thanks to IEEE. The document original is available on IEEE Xplore : http://dx.doi.org/10.1109/NMDC.2016.7777115.© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
HAL Id:hal-01657125
Audience (conference):International conference proceedings
Uncontrolled Keywords:
Institution:Other partners > IRT Saint Exupéry - Institut de Recherche Technologique (FRANCE)
Joseph B. Bernstein - IRT Saint Exupery - Agence Nationale de la Recherche - Airbus Operations SAS - Airbus Group Innovation - Continental Automotive France - Thales Alenia Space France - Thales Avionics - Safran Labinal Power Systems - Bordeaux University - Hirex engineering
Deposited On:06 Dec 2017 12:46

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