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Real 3D-packaging: a breakthrough for high power electronics for automotive applications

Favre, Philippe and Reynes, Jean-Michel and Favre, Jacques Real 3D-packaging: a breakthrough for high power electronics for automotive applications. (2015) Société des Ingénieurs de l'Automobile - SIA. 1-8. ISSN 0368-2579

(Document in English)

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Power electronics stands at the crossroad of highly convoluted disciplines of physics: thermal science, mechanics and electronics. In order to respond to the growing and demanding automotive market, designers have no choice but to assemble off-the-shelf parts, keeping the onus of managing themselves thermal losses and stray inductances at interfaces. Power mechatronics is the buzz word for this. It has for long envisioned double-sided cooling and wire-bondless interconnections as ways to go. Merging those impediments and opportunities into a global solution, aPSI3D has developed an integrated approach for multi-physical co-design with its customers, offering both plug-in cooled power modules and maximum value transfer to the inverter. Eventually, a 50 power module with imbedded cold plate size reduction for a 100kW inverter is obtained vs. state-of-the art pin fin standard products. With a 10nH stray inductance, this solution is paving the way to more than 100A wide bandgap semiconductor die based highly efficient power modules.

Item Type:Article
Audience (journal):National peer-reviewed journal
Audience (conference):National conference proceedings
Uncontrolled Keywords:
Institution:Other partners > aPSI3D (FRANCE)
Other partners > IRT Saint Exupéry - Institut de Recherche Technologique (FRANCE)
Laboratory name:
Deposited On:13 May 2020 10:21

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