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Laser transmission welding as an assembling process for high temperature electronic packaging.

Villar, Miguel and Chabert, France and Garnier, Christian and Nassiet, Valérie and Diez, Juan Carlos and Sotelo, Andres and Madre, Maria A. and Duchesne, Cyrille and Cussac, Philippe Laser transmission welding as an assembling process for high temperature electronic packaging. (2016) In: Electrical Systems for Aircraft, Railway, Ship Propulsion and Road Vehicles & International Transportation Electrification Conference (ESARS-ITEC), International Conference on, 2 November 2016 - 4 November 2016 (Toulouse, France).

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Official URL: http://dx.doi.org/10.1109/ESARS-ITEC.2016.7841379

Abstract

Higher efficiency, power density, reliability and longer lifetime of power electronic devices would stem from progresses in material science. In this work, we propose to use a high performance thermoplastic polymer PAEK as packaging box to extend the operating temperature above 200°C. More, the laser transmission welding process has been applied to PAEK to join the two-part module. In order to validate this assembling process, the temperature distribution inside the specimens was measured during laser transmission welding. The assembly consists of a quasi-amorphous sample as the upper part and a semi-crystalline sample as the lower part. The temperature fields were measured by infrared thermography with the camera sensor perpendicular to the welded interface. With an energy beam of 28 J.mm-2 and irradiation time of 15 s, we have noticed that the maximum temperature inside the sample is kept far from the PAEK degradation one. Moreover, the temperature at the interface reaches the melting temperature thus assuring enough mobility for polymeric chains to get adhesion at the interface. The location and size of the heat-affected zone has been determined. Finally, some frames were machined and successfully welded.

Item Type:Conference or Workshop Item (Paper)
Additional Information:Thanks to IEEE editor. The definitive version is available at : http://ieeexplore.ieee.org/document/7841379/. © 20xx IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
HAL Id:hal-01515535
Audience (conference):International conference proceedings
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Institution:Université de Toulouse > Institut National Polytechnique de Toulouse - INPT (FRANCE)
Other partners > CIRTEM (FRANCE)
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Deposited By: France CHABERT
Deposited On:16 Mar 2017 16:37

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