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Enhancing the Reactivity of Al/CuO Nanolaminates by Cu Incorporation at the Interfaces

Marín, Lorena and Nanayakkara, Charith E. and Veyan, Jean-Francois and Warot-Fonrose, Bénédicte and Joulié, Sébastien and Estève, Alain and Tenailleau, Christophe and Chabal, Yves J. and Rossi, Carole Enhancing the Reactivity of Al/CuO Nanolaminates by Cu Incorporation at the Interfaces. (2015) ACS Applied Materials and Interfaces, 7 (22). 11713-11718. ISSN 1944-8244

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Official URL: http://dx.doi.org/10.1021/acsami.5b02653

Abstract

In situ deposition of a thin (∼5 nm) layer of copper between Al and CuO layers is shown to increase the overall nanolaminate material reactivity. A combination of transmission electron microscopy imaging, in situ infrared spectroscopy, low energy ion scattering measurements, and first-principles calculations reveals that copper spontaneously diffuses into aluminum layers (substantially less in CuO layers). The formation of an interfacial Al:Cu alloy with melting temperature lower than pure Al metal is responsible for the enhanced reactivity, opening a route to controlling the stochiometry of the aluminum layer and increasing the reactivity of the nanoenergetic multilayer systems in general.

Item Type:Article
Additional Information:Thanks to ACS editor. The definitive version is available at http://pubs.acs.org
HAL Id:hal-01452182
Audience (journal):International peer-reviewed journal
Uncontrolled Keywords:
Institution:French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE)
Université de Toulouse > Institut National Polytechnique de Toulouse - INPT (FRANCE)
Université de Toulouse > Institut National des Sciences Appliquées de Toulouse - INSA (FRANCE)
Université de Toulouse > Institut Supérieur de l'Aéronautique et de l'Espace - ISAE-SUPAERO (FRANCE)
Université de Toulouse > Université Toulouse III - Paul Sabatier - UPS (FRANCE)
Université de Toulouse > Université Toulouse - Jean Jaurès - UT2J (FRANCE)
Other partners > University of Texas at Dallas (USA)
Laboratory name:
Funders:
French Technological Network RENATECH - CNRS
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Deposited By: cirimat webmestre
Deposited On:01 Feb 2017 15:28

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