Arnaud, Claire and Lecouturier, Florence and Mesguich, David and Ferreira, Nelson and Chevallier, Geoffroy and Estournès, Claude and Weibel, Alicia and Peigney, Alain and Laurent, Christophe High strength–high conductivity nanostructured copper wires prepared by spark plasma sintering and room-temperature severe plastic deformation. (2016) Materials Science and Engineering A, 649. 209-213. ISSN 0921-5093
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(Document in English)
PDF (Author's version) - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader 450kB |
Official URL: http://dx.doi.org/10.1016/j.msea.2015.09.122
Abstract
A pure copper cylinder with micrometric grains was prepared by spark plasma sintering and was wire-drawn at room temperature. The ultimate tensile strength of the conducting wires is 600 MPa at room temperature. This originates from the propagation of dislocations by an Orowan mechanism in grains smaller than 250 nm.
| Item Type: | Article |
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| Additional Information: | Thanks to Elsevier editor. The definitive version is available at http://www.sciencedirect.com The original PDF of the article can be found at Materials Science & Engineering A website : http://www.sciencedirect.com/science/article/pii/S0921509315304603 |
| HAL Id: | hal-03516403 |
| Audience (journal): | International peer-reviewed journal |
| Uncontrolled Keywords: | |
| Institution: | French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE) Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE) Université de Toulouse > Université Toulouse III - Paul Sabatier - UT3 (FRANCE) |
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| Statistics: | download |
| Deposited On: | 06 Feb 2017 10:59 |
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