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Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications

Msolli, Sabeur and Alexis, Joël and Dalverny, Olivier and Karama, Moussa Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications. (2015) Microelectronics Reliability (55). 164-171. ISSN 0026-2714

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Official URL: http://dx.doi.org/10.1016/j.microrel.2014.09.021

Abstract

An experimental investigation of two potential candidate materials for the diamond die attachment is presented in this framework. These efforts are motivated by the need of developing a power electronic packaging for the diamond chip. The performance of the designed packaging relies particularly on the specific choice of the solder alloys for the die/substrate junction. To implement a high temperature junction, AuGe and AlSi eutectic alloys were chosen as die attachment and characterized experimentally. The choice of the AlSi alloy is motivated by its high melting temperature Tm (577°C), its practical elaboration process and the restrictions of hazardous substances (RoHS) inter alia. The AuGe eutectic solder alloy has a melting temperature (356°C) and it is investigated here for comparison purposes with AlSi. The paper presents experimental results such as SEM observations of failure facies which are obtained from mechanical shear as well as cyclic nano-indentation results for the mechanical hardening/softening evaluation under cyclic loading paths.

Item Type:Article
Additional Information:Thanks to Elsevier editor. The definitive version is available at : http://www.journals.elsevier.com/microelectronics-reliability/
HAL Id:hal-01212091
Audience (journal):International peer-reviewed journal
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Institution:Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
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Deposited On:21 Aug 2015 08:44

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