Durou, Hugo and Pech, David and Colin, René-David and Simon, Patrice and Taberna, Pierre-Louis and Brunet, Magali
Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy.
(2012)
Microsystem Technologies, 18 (4). 467-473. ISSN 0946-7076
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(Document in English)
PDF (Author's version) - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader 663kB |
Official URL: http://dx.doi.org/10.1007/s00542-011-1415-7
Abstract
In this paper a wafer-level process is proposed to fully integrate carbon-based micro-supercapacitor onto silicon substrate. This process relies on the deposition of a paste containing carbon, PVDF and acetone into cavities etched in silicon. After electrolyte deposition in a controlled atmosphere, a wafer-level encapsulation is realized. Cyclic voltammetry performed on non-encapsulated microcomponents showed specific energy of 257 mJ cm-2 for 336 lm deep cavities. The specific encapsulation process developed was tested separately and proved to be efficient in terms of resistance to organic electrolytes and mechanical strength.
Item Type: | Article |
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Additional Information: | Thanks to Springer Verlag. The definitive version is available at http://link.springer.com The original PDF of the article can be found at : http://link.springer.com/article/10.1007%2Fs00542-011-1415-7 |
HAL Id: | hal-01151753 |
Audience (journal): | International peer-reviewed journal |
Uncontrolled Keywords: | |
Institution: | French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE) Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE) Université de Toulouse > Institut National des Sciences Appliquées de Toulouse - INSA (FRANCE) Université de Toulouse > Université Toulouse III - Paul Sabatier - UT3 (FRANCE) Université de Toulouse > Université Toulouse - Jean Jaurès - UT2J (FRANCE) Université de Toulouse > Université Toulouse 1 Capitole - UT1 (FRANCE) |
Laboratory name: | |
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Deposited On: | 13 May 2015 13:22 |
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