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Numerical modeling and prediction of thermomechanical degradation of power electronic packaging

Baazaoui, Ahlem and Dalverny, Olivier and Alexis, Joël and Karama, Moussa Numerical modeling and prediction of thermomechanical degradation of power electronic packaging. (2013) In: ICSAAM 2013, The 5th International Conference on Structural Analysis of Advanced Materials, 23 September 2013 - 26 September 2013 (Island of Kos, Greece).

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Abstract

This work aims at numerical thermomechanical studies of two types of high temperature silver connections elaborated at low temperatures, the transient liquid phase bonding (TLPB) of Ag-In and silver nanoparticles sintering, using test vehicles representing the final packaging assemblies of diamond components. The simulation is performed using a finite element code on 2D and 3D assemblies. The stress distribution in the assemblies and in the two die-attachments was studied during thermal cycling in the range temperature between -50 and 300°C. A comparison of these two technology trends with respect to their applicability for power electronics packaging was conducted.

Item Type:Conference or Workshop Item (Paper)
HAL Id:hal-00944556
Audience (conference):International conference proceedings
Uncontrolled Keywords:
Institution:Université de Toulouse > Institut National Polytechnique de Toulouse - Toulouse INP (FRANCE)
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Deposited On:31 Jan 2014 12:45

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