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Items where Person is "Msolli, Sabeur"

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Koné, Sodjan and Schneider, Henri and Isoird, Karine and Thion, Fabien and Achard, Jocelyn and Issaoui, Riadh and Msolli, Sabeur and Alexis, Joël An assessment of contact metallization for high power and high temperature diamond Schottky devices. (2012) Diamond and Related Materials, vol. 27-28 . pp. 23-28. ISSN 0925-9635

Msolli, Sabeur and Baazaoui, Ahlem and Dalverny, Olivier and Alexis, Joël and Karama, Moussa Viscoplastic behavior of diamond die attach subjected to high temperature conditions. (2012) In: 13th International conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems, EuroSimE 2012, 16-18 Apr 2012, Lisbon, Portugal .

Msolli, Sabeur and Dalverny, Olivier and Alexis, Joël and Karama, Moussa Effects of the Unified Viscoplastic Formulation and Temperature Terms on the Thermomechanical Behavior of Soldering Materials. (2012) Key Engineering Materials, vol. 498 . pp. 219-226. ISSN 1662-9795

Msolli, Sabeur and Dalverny, Olivier and Alexis, Joël and Karama, Moussa Experimental and mechanical characterizations of a lead free solder alloy for electronic devices. (2012) Advanced Materials Research, vol. 423 . pp. 210-217. ISSN 1022-6680

Msolli, Sabeur. Modélisation thermomécanique de l'assemblage d'un composant diamant pour l'électronique de puissance haute température. PhD, Institut National Polytechnique de Toulouse, 2011

Msolli, Sabeur and Dalverny, Olivier and Alexis, Joël and Karama, Moussa Implicit integration scheme for porous viscoplastic potential-based constitutive equations. (2011) Procedia Engineering, vol. 10 . pp. 1544-1549. ISSN 1877-7058

Civrac de Fabian, Gabriel and Msolli, Sabeur and Alexis, Joël and Dalverny, Olivier and Schneider, Henri Electrical and mechanical characterisation of Si/Al ohmic contacts on diamond. (2010) IEEE Electronics Letters , vol. 46 (n° 11). pp. 791-793. ISSN 0013-5194

Msolli, Sabeur and Dalverny, Olivier and Alexis, Joël and Karama, Moussa Mechanical characterization of an Au-Ge solder alloy for high temperature electronic devices. (2010) In: 6th International Conference on Integrated Power Electronics Systems (CIPS), 16 March 2010 - 18 March 2010 (Nuremberg, Germany).

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