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Comparison between electromagnetic and thermal stress induced by Direct Current flow in IGBT bond wires

Medjahed, Hassen and Vidal, Paul-Etienne and Nogarède, Bertrand Comparison between electromagnetic and thermal stress induced by Direct Current flow in IGBT bond wires. (2012) In: International conference on integrated power electronics systems - CIPS 2012, 6 March 2012 - 8 March 2012 (Nuremberg, Germany).

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Official URL: http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=18059

Abstract

This study is focused on the IGBT wire bond behaviour. We apply a direct current flow within the wire to reproduce the thermal cycling test used in reliability studies. On one hand we compare the temperature distribution between 3D FEM simulation and the experimental temperature measurement. We also point out the Von-Mises stress obtained. On the other hand we compare the thermo-mechanical results to those obtained with a 1D simplified thermal model. We also take into account the electromagnetic force and the mechanical stress that could be induced on the bond wire. Some experimental and simulation results are given

Item Type:Conference or Workshop Item (Paper)
Additional Information:Verlag editor does not allow open archive publication.
Audience (conference):International conference proceedings
Uncontrolled Keywords:
Institution:French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE)
Université de Toulouse > Institut National Polytechnique de Toulouse - INPT (FRANCE)
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Deposited By: Paul-Etienne Vidal
Deposited On:17 May 2013 12:34

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