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Effects of the Unified Viscoplastic Formulation and Temperature Terms on the Thermomechanical Behavior of Soldering Materials

Msolli, Sabeur and Dalverny, Olivier and Alexis, Joël and Karama, Moussa Effects of the Unified Viscoplastic Formulation and Temperature Terms on the Thermomechanical Behavior of Soldering Materials. (2012) Key Engineering Materials, vol. 498 . pp. 219-226. ISSN 1662-9795

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Official URL: http://dx.doi.org/10.4028/www.scientific.net/KEM.498.219

Abstract

Solder materials are critical packaging compounds and due to usually weakest melting temperature among packaging constitutive materials, thus, they are frequently subjected to a multitude of physical phenomena: creep, fatigue and combined hardening effects. The complexity and interaction of such factors must be considered in suitable way in the mechanical behavior modeling using the appropriate material behavior laws. The choice of the mechanical model depends on several factors such as the complexity of constitutive equations to be integrated, the availability and suitability of implementation in the FE codes, the number of parameters to be identified, the capability of the model to represent the most common physical features of the material… Following these observations and in order to deal with these critical remarks, comparisons between the most common unified viscoplastic models should be done in the local and finite element levels for the decision upon the most efficient model. That is the aim of this paper with application to a tin based solder token as the test material.

Item Type:Article
Additional Information:Thanks to Trans Tech publications.The definitive version is available at http://dx.doi.org/10.4028/www.scientific.net/KEM.498.219
Audience (journal):International peer-reviewed journal
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Institution: Université de Toulouse > Institut National Polytechnique de Toulouse - INPT
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Deposited By: Joël ALEXIS

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