Chasserio, Nadège and Guillemet-Fritsch, Sophie and Lebey, Thierry and Dagdag, Sélim Ceramic Substrates for High-temperature Electronic Integration. (2009) Journal of Electronic Materials, vol. 38 (n° 1). pp. 164-174. ISSN 0361-5235
![[img]](http://oatao.univ-toulouse.fr/style/images/fileicons/application_pdf.png) | (Document in English) PDF (Author's version) - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader 597Kb |
Official URL: http://dx.doi.org/10.1007/s11664-008-0571-8
Abstract
One of the most attractive ways to increase power handling capacity in power modules is to increase the operating temperature using wide-band-gap semiconductors. Ceramics are ideal candidates for use as substrates in high-power high-temperature electronic devices. The present article aims to determine the most suitable ceramic material for this application.
| Item Type: | Article |
|---|---|
| Additional Information: | Thanks to Springer Boston editor. The definitive version is available at http://www.springer.com/birkhauser?SGWID=0-40290-0-0-0 The original PDF of the article can be found at Journal of Electronic Materials website : http://www.springerlink.com/content/7807j52g68435t19/ |
| Audience (journal): | International peer-reviewed journal |
| Uncontrolled Keywords: | |
| Institution: | French research institutions > Centre National de la Recherche Scientifique - CNRS Université de Toulouse > Institut National Polytechnique de Toulouse - INPT Université de Toulouse > Université Paul Sabatier-Toulouse III - UPS Other partners > ALSTOM Transport (FRANCE) |
| Laboratory name: | |
| Statistics: | download |
| Total amount of citations (from ISI Web of Science): | 1 |
| Deposited By: | Nihad Lahdifi |
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