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Characterisation and macro-modeling of patterned micronic and nano-scale dummy metal-fills in integrated circuits

Wane, Sidina and Bajon, Damienne Characterisation and macro-modeling of patterned micronic and nano-scale dummy metal-fills in integrated circuits. (2009) In: 2009 International Microwaves Symposium, 07-12 June 2009, Boston, United States .

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Official URL: http://dx.doi.org/10.1109/RFIC.2009.5135515

Abstract

In this paper, a wideband characterization and macro-modeling of patterned micronic and nano-scale dummy metal-fills is presented. Impacts of patterned dummy metal-fill topologies including square, cross, vertical and horizontal shaped arrays on electrical performances (isolation/coupling, attenuation, guiding properties, etc…) are investigated. The validity of the proposed macro-modeling methodology is demonstrated by comparison with high frequency measurements of dedicated carrier structures including on-chip interconnects and RF inductive loops. An original extraction approach, based on local ground concept, is proposed to capture high frequency behaviour of dummy metal-fill in physics-based compact broadband SPICE model. The RLC parameters are accurately derived using fully scalable closed-form semi-analytical expressions.

Item Type:Conference or Workshop Item (Paper)
Additional Information:Thanks to the Institute of Electrical and Electronics Engineers (IEEE).The original PDF can be found on the IEEE website: http://ieeexplore.ieee.org/search/wrapper.jsp?arnumber=5135515
Audience (conference):International conference proceedings
Uncontrolled Keywords:
Institution: Université de Toulouse > Institut Supérieur de l'Aéronautique et de l'Espace - ISAE
Other partners > NXP Semiconductors (FRANCE)
Laboratory name:
Département d'Electronique, Optronique et Signal - DEOS (Toulouse, France) - Micro-ondes et Optique pour Systèmes Embarqués - MOSE
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Deposited By:Cécile de_roquemaurel

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