Polyimide (PI) films by chemical vapor deposition (CVD): Novel design, experiments and characterization

Abstract

Polyimide (PI) has been deposited by chemical vapor deposition (CVD) under vacuum over the past 20 years. In the early nineties, studies, experiences and characterization were mostly studied as depositions from the co-evaporation of the dianhydride and diamine monomers. Later on, several studies about its different applications due to its interesting mechanical and electrical properties enhanced its development. Nowadays, not many researches around PI deposition are being carried. This paper presents a PI film deposition research project with an original CVD process design. The deposition is performed under ambient conditions (atmospheric pressure) through a gas flux vector. Design of apparatus, deposition conditions and preliminary characterizations (IR, SEM and surface analyses) are discussed.