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Silver sintering for power electronics integration

Buttay, Cyril and Allard, Bruno and Riva, Raphaël Silver sintering for power electronics integration. (2015) In: ICEP-IAAA (International Conference on Electronic Packaging, & IMAPS All Asia Conference), 14 April 2015 - 17 April 2015 (Kyoto, Japan).

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Official URL: http://dx.doi.org/10.1109/ICEP-IAAC.2015.7111076

Abstract

Silver sintering is an attractive alternative to soldering in power electronics, as it offers higher electrical and thermal performance. Furthermore, sintered attaches can operate at a higher temperature. In this paper, we investigate the use of silver sintering for the bonding of passive components, and for the manufacturing of so-called 3D-modules. It is shown that this technique is well suited, as it makes it possible to operate at very high temperature (up to 310 °C demonstrated), and as it simplifies the assembly process (several identical sintering steps can be performed successively without problem)

Item Type:Conference or Workshop Item (Paper)
Additional Information:Thanks to IEEE. The document original is available on IEEE Xplore : http://dx.doi.org/10.1109/ICEP-IAAC.2015.7111076. ©2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
HAL Id:hal-01715120
Audience (conference):International conference proceedings
Uncontrolled Keywords:
Institution:French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE)
Other partners > Institut National des Sciences Appliquées de Lyon - INSA (FRANCE)
Other partners > Université Claude Bernard-Lyon I - UCBL (FRANCE)
Other partners > IRT Saint Exupéry - Institut de Recherche Technologique (FRANCE)
Laboratory name:
Funders:
Thor - EPAHT
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Deposited By: Marie-Pierre Le Tallec
Deposited On:11 Dec 2017 15:13

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