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High strength–high conductivity nanostructured copper wires prepared by spark plasma sintering and room-temperature severe plastic deformation

Arnaud, Claire and Lecouturier, Florence and Mesguich, David and Ferreira, Nelson and Chevallier, Geoffroy and Estournès, Claude and Weibel, Alicia and Peigney, Alain and Laurent, Christophe High strength–high conductivity nanostructured copper wires prepared by spark plasma sintering and room-temperature severe plastic deformation. (2016) Materials Science and Engineering A, 649. 209-213. ISSN 0921-5093

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Official URL: http://dx.doi.org/10.1016/j.msea.2015.09.122

Abstract

A pure copper cylinder with micrometric grains was prepared by spark plasma sintering and was wire-drawn at room temperature. The ultimate tensile strength of the conducting wires is 600 MPa at room temperature. This originates from the propagation of dislocations by an Orowan mechanism in grains smaller than 250 nm.

Item Type:Article
Additional Information:Thanks to Elsevier editor. The definitive version is available at http://www.sciencedirect.com The original PDF of the article can be found at Materials Science & Engineering A website : http://www.sciencedirect.com/science/article/pii/S0921509315304603
Audience (journal):International peer-reviewed journal
Uncontrolled Keywords:
Institution:French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE)
Université de Toulouse > Institut National Polytechnique de Toulouse - INPT (FRANCE)
Université de Toulouse > Université Toulouse III - Paul Sabatier - UPS (FRANCE)
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Deposited By: cirimat webmestre
Deposited On:06 Feb 2017 10:59

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