OATAO - Open Archive Toulouse Archive Ouverte Open Access Week

Exploration of high density interconnect 3D stacking for SPAD arrays

Lalucaa, Valerian and Martin-Gonthier, Philippe and Rolando, Sébastien and Magnan, Pierre Exploration of high density interconnect 3D stacking for SPAD arrays. (2015) In: Proceedings of Workshop CMOS Image Sensors for High Performance Applications, 18 November 2015 - 19 November 2015 (Toulouse, France).

[img] (Document in English)

PDF (Author's version) - Depositor and staff only - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader
444kB
[img] (Document in English)

PDF (Author's version) - Depositor and staff only - Requires a PDF viewer such as GSview, Xpdf or Adobe Acrobat Reader
1MB

Abstract

Recent improvements in high density interconnect technologies bring new options for microelectronic device processes. One of these options is currently explored for CMOS image sensor (CIS) applications. The high interconnect density is used to create one bond point per pixel while maintaining a relatively low pixel pitch. The resulting electro-optical performances are improved and the constraints on electronic readout circuit are relaxed. The advantages are particularly interesting for SPAD arrays. The SPADs need large area electronic readout circuits. Moreover, their intrinsic sensitivity makes them vulnerable to the noise induced by the close proximity of the digital readout circuits. This work analyzes the benefits and limitations of the 3D high density interconnect process. The laboratory’s experience of the design of a 3D-IC conventional CIS is used to design and simulate a SPAD array image sensor; showing the possibilities for both performances and system level integration.

Item Type:Conference or Workshop Item (Speech)
Audience (conference):International conference without published proceedings
Uncontrolled Keywords:
Institution:Other partners > Direction Générale pour l'Armement - DGA (FRANCE)
Université de Toulouse > Institut Supérieur de l'Aéronautique et de l'Espace - ISAE-SUPAERO (FRANCE)
Laboratory name:
Département d'Electronique, Optronique et Signal - DEOS (Toulouse, France) - Conception d’Imageurs Matriciels Intégrés - CIMI
Statistics:download
Deposited By: Valerian Lalucaa
Deposited On:25 Jan 2016 14:11

Repository Staff Only: item control page