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Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy

Durou, Hugo and Pech, David and Colin, René-David and Simon, Patrice and Taberna, Pierre-Louis and Brunet, Magali Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy. (2012) Microsystem Technologies, 18 (4). 467-473. ISSN 0946-7076

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Official URL: http://dx.doi.org/10.1007/s00542-011-1415-7

Abstract

In this paper a wafer-level process is proposed to fully integrate carbon-based micro-supercapacitor onto silicon substrate. This process relies on the deposition of a paste containing carbon, PVDF and acetone into cavities etched in silicon. After electrolyte deposition in a controlled atmosphere, a wafer-level encapsulation is realized. Cyclic voltammetry performed on non-encapsulated microcomponents showed specific energy of 257 mJ cm-2 for 336 lm deep cavities. The specific encapsulation process developed was tested separately and proved to be efficient in terms of resistance to organic electrolytes and mechanical strength.

Item Type:Article
Additional Information:Thanks to Springer Verlag. The definitive version is available at http://link.springer.com The original PDF of the article can be found at : http://link.springer.com/article/10.1007%2Fs00542-011-1415-7
HAL Id:hal-01151753
Audience (journal):International peer-reviewed journal
Uncontrolled Keywords:
Institution:French research institutions > Centre National de la Recherche Scientifique - CNRS (FRANCE)
Université de Toulouse > Institut National Polytechnique de Toulouse - INPT (FRANCE)
Université de Toulouse > Institut National des Sciences Appliquées de Toulouse - INSA (FRANCE)
Université de Toulouse > Université Toulouse III - Paul Sabatier - UPS (FRANCE)
Université de Toulouse > Université Toulouse - Jean Jaurès - UT2J (FRANCE)
Université de Toulouse > Université Toulouse 1 Capitole - UT1 (FRANCE)
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Deposited By: cirimat webmestre
Deposited On:13 May 2015 13:22

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