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New insulation fiberboards from sunflower cake with improved thermal and mechanical properties

Evon, Philippe and Vinet, Justine and Rigal, Matthieu and Labonne, Laurent and Vandenbossche, Virginie and Rigal, Luc New insulation fiberboards from sunflower cake with improved thermal and mechanical properties. (2014) In: 2nd International Conference on Bio-based Polymers and Composites Conference, 24 August 2014 - 28 August 2014 (Visegrád, Hungary). (Unpublished)

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Abstract

New insulation fiberboards from sunflower cake with improved thermal and mechanical properties were produced by pressing at ambient temperature. Best compromise between mechanical and heat insulation properties (λ = 77.6 mW/m K at 25°C) was a starch-based board with 20% binder content. Because of its promising heat insulation properties, this new fiberboard could be positioned on walls and ceilings for thermal insulation of buildings. The bulk cake was an even better insulation material (only 62.0 mW/m K for thermal conductivity at 25°C): usable as loose fill in the attics of houses.

Item Type:Conference or Workshop Item (Poster)
Additional Information:Thanks to BiPoCo 2014 : http://www.bipoco2014.hu/
Audience (conference):International conference proceedings
Uncontrolled Keywords:
Institution:Université de Toulouse > Institut National Polytechnique de Toulouse - INPT (FRANCE)
French research institutions > Institut National de la Recherche Agronomique - INRA (FRANCE)
Laboratory name:
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Deposited By: Philippe EVON
Deposited On:28 Aug 2014 13:13

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